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HMC409Datasheet PDF
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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
9
9 - 5
AMPLIFIERS - LINEAR & POWER - SMT
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Absolute Maximum Ratings
Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc
Control Voltage (Vpd) +5.5 Vdc
RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +10 dBm
Junction Temperature 150 °C
Continuous Pdiss (T = 85 °C)
(derate 57.5 mW/°C above 85 °C)
3.74 W
Thermal Resistance
(junction to ground paddle)
17.4 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C
Vs (Vdc) Icq (mA)
4.75 516
5.0 615
5.25 721
Typical Supply, Current vs. Supply
Voltage, Vcc1 = Vcc2 = Vpd
HMC409LP4 / 409LP4E
GaAs InGaP HBT 1 WATT
POWER AMPLIFIER, 3.3 - 3.8 GHz
v03.0710
Part Number Package Body Material Lead Finish MSL Rating Package Marking
[3]
HMC409LP4 Low Stress Injection Molded Plastic Sn/Pb Solder
MSL3
[1]
H409
XXXX
HMC409LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
MSL3
[2]
H409
XXXX
[1] Max peak reow temperature of 235 °C
[2] Max peak reow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
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