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TOP245YNDatasheet PDF
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TOP242-250
49
O
11/05
.165 (4.19)
.185 (4.70)
R07C
TO-263-7C
PI-2664-122004
-A-
LD #1
.580 (14.73)
.620 (15.75)
.390 (9.91)
.420 (10.67)
.326 (8.28)
.336 (8.53)
.055 (1.40)
.066 (1.68)
.100 (2.54)
REF
0.68 (1.73)
MIN
.208 (5.28)
Ref.
.024 (0.61)
.034 (0.86)
.225 (5.72)
MIN
.245 (6.22)
MIN
.000 (0.00)
.010 (0.25)
.010 (0.25)
.090 (2.29)
.110 (2.79)
.012 (0.30)
.024 (0.61)
°
8 -
°
0
.045 (1.14)
.055 (1.40)
.050 (1.27)
Notes:
1. Package Outline Exclusive of Mold Flash & Metal Burr
.
2. Package Outline Inclusive of Plating Thickness.
3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
4. Controlling Dimensions are in Inches. Millimeter
Dimensions are shown in Parentheses.
5. Minimum metal to metal spacing at the package body
for the omitted pin locations is .068 in. (1.73 mm).
.004 (0.10)
.315 (8.00)
.128 (3.25)
.038 (0.97)
.050 (1.27)
.380 (9.65)
.638 (16.21)
Solder Pad
Dimensions
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