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THGBMFG8C2LBAIL Datasheet PDF - Toshiba
Manufacturer:
Toshiba
Case Package:
FBGA-153
Description:
NAND Flash Serial e-MMC 1.8V/3.3V 256G-bit 256G/64G/32G x 1/4Bit/8Bit 153Pin FBGA
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THGBMFG8C2LBAIL Datasheet PDF
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THGBMFG8C2LBAIL Datasheet PDF (5 Pages)
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THGBMFG8C2LBAIL Specifications
TYPE
DESCRIPTION
Number of Pins
153 Pin
Case/Package
FBGA-153
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-25 ℃
THGBMFG8C2LBAIL Size & Package
TYPE
DESCRIPTION
Product Lifecycle Status
Active
Operating Temperature
-25℃ ~ 85℃
THGBMFG8C2LBAIL Environmental
THGBMFG8C2LBAIL Export Classifications
THGBMFG8C2LBAIL Documents
THGBMFG8C2LBAIL
Other Datasheet PDF
Toshiba
5 Pages / 1.21 MByte
THGBMFG8C2 Documents
THGBMFG8C2
LBAIL
Datasheet PDF
Toshiba
NAND Flash Serial e-MMC 1.8V/3.3V 256G-bit 256G/64G/32G x 1/4Bit/8Bit 153Pin FBGA
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