| TYPE | DESCRIPTION |
|---|
| Mounting Style | Through Hole |
| Number of Pins | 14 Pin |
| Case/Package | CDIP-14 |
| Forward Voltage | 1.7 V |
| Power Dissipation | 0.6 W |
| Reverse recovery time | 20 ns |
| Forward Current | 300 mA |
| Forward Current (Max) | 0.3 A |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -65 ℃ |
| Power Dissipation (Max) | 600 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tube |
| Size-Height | 3.56 mm |
| Operating Temperature | -65℃ ~ 150℃ (TJ) |
These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-PIN ceramic DIP package for use as steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing them to the positive side of the power supply line and to ground (see Figure 1). An external TVS diode may be added between the positive supply line and ground to prevent over-voltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as high-density packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting.
Microsemi
2 Pages / 0.13 MByte
Microsemi
2 Pages / 0.07 MByte
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