| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 2 Pin |
| Current Rating | 300 mA |
| Case/Package (SI) | 2012 |
| Case/Package | 0805 |
| Resistance | 350 mΩ |
| Shielding | No |
| Test Frequency | 100 MHz |
| DC Resistance (DCR) | 0.35 Ω |
| Current Rating (Max) | 300 mA |
| Current Rating (DC) | 300 mA |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Resistance (DC Max) | 0.35 Ω |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 2 mm |
| Size-Width | 1.25 mm |
| Size-Height | 1.1 mm |
| Operating Temperature | -55℃ ~ 125℃ |
The 2508056017Y0 is a Multilayer Chip Bead suitable for cellular phones, laptops and pagers. The multilayer chip bead to suppress conducted EMI signals. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. The chip bead is available in standard, high and GHz signal speeds. The nominal impedance with a ±25% tolerance is specified for the + marked 100MHz. The chip bead is measured for impedance on the HP 4291A and fixture HP 16192A.
● Low current
● Standard signal speed
● 100% Tested for impedance and DC resistance
● -55 to 125°C Operating temperature range
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