TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Frequency | 500 MHz |
Number of Pins | 3 Pin |
Case/Package | TO-18 |
Power Dissipation | 360 mW |
Breakdown Voltage (Collector to Emitter) | 15 V |
hFE Min | 20 @100mA, 1V |
hFE Max | 120 |
Input Power (Max) | 360 mW |
Operating Temperature (Max) | 200 ℃ |
Operating Temperature (Min) | -65 ℃ |
Junction Temperature | -65℃ ~ 200℃ |
Power Dissipation (Max) | 360 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Bulk |
Material | Silicon |
Size-Length | 5.84 mm |
Size-Width | 5.84 mm |
Size-Height | 5.33 mm |
Operating Temperature | -65℃ ~ 200℃ (TJ) |
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