TYPE | DESCRIPTION |
---|
Number of Contacts | 20 Contact |
Gender | Female |
Mounting Style | Surface Mount |
Contact Plating | Tin, Tin over Nickel, Gold |
Voltage Rating (AC) | 30.0 V |
Current Rating | 4 A |
Insulation Resistance | 5000 MΩ |
Number of Rows | 2 Row |
Pin Pitch | 1.27 mm |
Orientation | Vertical |
Flammability Rating | UL 94 V-0 |
Number of Positions | 20 Position |
Current Rating (Max) | 4A/触头 |
Voltage Rating (Max) | 30 VAC |
Voltage Rating | 30 V |
Maximum Contact Resistance (Max) | 16 mΩ |
●TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
●AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapor phase reflow) surface mount processes.
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