| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Case/Package | TO-263 |
| Power Dissipation | 1.25 W |
| Thermal Resistance | 18 ℃/W |
| Thermal Resistance @ Forced Air Flow | 10.0℃/W @200LFM |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Color | Tin |
| Material | Copper |
| Size-Length | 12.70 mm |
| Size-Width | 12.7 mm |
| Size-Height | 10.16 mm |
The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
● Horizontal mount orientation
Aavid Thermalloy
4 Pages / 0.23 MByte
Aavid Thermalloy
117 Pages / 8.31 MByte
Aavid Thermalloy
116 Pages / 8.52 MByte
Aavid Thermalloy
Heat Sink Passive TO-263 SMD
Aavid Thermalloy
AAVID THERMALLOY 573300D00010G Heat Sink, Square, PCB, For D-Pak Devices, TO-263, 18℃/W, 10.16mm, 12.7mm, 26.16mm
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