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86093968813H55V1LF Datasheet PDF - Future Communications IC

Manufacturer:	Future Communications IC
Documentation:	86093968813H55V1LF Datasheet (2 Pages)
Pictures:	3D Model Symbol Footprint Pinout Product Pictures

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86093968813H55V1LF Specifications

TYPE	DESCRIPTION
Number of Positions	96 Position

Future Communications IC

2 Pages / 0.11 MByte

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Conn DIN 41612 RCP 96 POS 2.54mm Solder RA Thru-Hole Tray

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Future Communications IC

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