Features and Benefits
●Military Temperature Tested and Qualified
●• Each Device Tested from –55°C to 125°C
●Firm-Error Immune
●• Not Susceptible to Neutron-Induced Configuration Loss
●Low Power
●• Dramatic Reduction in Dynamic and Static Power
●• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power†
●• Low Power Consumption in Flash
●Freeze Mode Allows for
●Instantaneous Entry To / Exit From Low-Power Flash
●Freeze
●Modeƒ
●• Supports Single-Voltage System Operation
●• Low-Impedance Switches
●High Capacity
●• 600 k to 3 M System Gates
●• Up to 504 kbits of True Dual-Port SRAM
●• Up to 620 User I/Os
●Reprogrammable Flash Technology
●• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
●• Live-at-Power-Up (LAPU) Level 0 Support
●• Single-Chip Solution
●• Retains Programmed Design when Powered Off
●High Performance
●• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System
●Performance
●• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit
●PCI (1.2 V systems)
●In-System Programming (ISP) and Security
●• Secure ISP Using On-Chip 128-Bit Advanced Encryption
●Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
●• FlashLock® to Secure FPGA Contents
●High-Performance Routing Hierarchy
●• Segmented, Hierarchical Routing and Clock Structure
●• High-Performance, Low-Skew Global Network
●• Architecture Supports Ultra-High Utilization
