The ADS5444 is a 13-bit 250-MSPS analog-to-digital converter (ADC) that operates from a 5-V supply, while providing LVDS-compatible digital outputs from a 3.3-V supply. The ADS5444 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5444 has outstanding low noise and linearity over input frequency.
●The ADS5444 is available in an 80-pin TQFP PowerPAD package. The ADS5444 is built on a state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (-55°C to 125°C).
● Controlled Baseline
● One Assembly
● One Test Site
● One Fabrication Site
● Extended Temperature Performance of -55°C to 125°C
● Enhanced Diminishing Manufacturing Sources (DMS) Support
● Enhanced Product-Change Notification
● Qualification Pedigree(1)
● 13-Bit Resolution
● 250-MSPS Sample Rate
● SNR = 69 dBc at 100-MHz IF and 250 MSPS
● SFDR = 76 dBc at 100-MHz IF and 250 MSPS
● SNR = 67.7 dBc at 230-MHz IF and 250 MSPS
● SFDR = 77 dBc at 230-MHz IF and 250 MSPS
● 2.2-VPP Differential Input Voltage
● Fully Buffered Analog Inputs
● 5-V Analog Supply Voltage
● LVDS Compatible Outputs
● Total Power Dissipation: 2 W
● Offset Binary Output Format
● TQFP-80 PowerPAD Package
● Pin Compatible With the ADS5440
● Military Temperature Range = -55°C to 125°C
● APPLICATIONS
● Test and Measurement
● Software-Defined Radio
● Multichannel Base Station Receivers
● Base Station Tx Digital Predistortion
● Communications Instrumentation
● RELATED PRODUCTS
● ADS5424 - 14-Bit, 105 MSPS ADC
● ADS5423 - 14-Bit, 80 MSPS ADC
● ADS5440 - 13-Bit, 210 MSPS ADC
●(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
●PowerPAD is a trademark of Texas Instruments.
