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ATA5577M233AC-DBB
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ATA5577M233AC-DBB Datasheet PDF - Microchip

Manufacturer:Microchip
Category:RF Modules & ICs
Case Package:BUMP DIE/ WAFER (WB)
Description:NFC/RFID Tag and Transponder IC 100kHz to 150kHz 363Bit Automotive Die
Documentation:ATA5577M233AC-DBB Datasheet (47 Pages)Package Outline Dimension on38 Page40 Page41 Page42 Page43 Page
Part Numbering System on36 Page37 Page38 Page
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ATA5577M233AC-DBB Datasheet PDF (47 Pages)
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ATA5577M233AC-DBB Specifications

TYPEDESCRIPTION
Frequency100kHz ~ 150kHz
Case/PackageBUMP DIE/ WAFER (WB)
Operating Temperature (Max)85 ℃
Operating Temperature (Min)-40 ℃
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ATA5577M233AC-DBB Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusUnknown
PackagingBulk
Size-Height0.18 mm
Operating Temperature-40℃ ~ 85℃
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ATA5577M233AC-DBB Documents

ATA5577M233AC-DBB Datasheet
Microchip
47 Pages / 1.8 MByte
ATA5577M233AC-DBB Other Datasheet PDF
Microchip
47 Pages / 4.2 MByte
ATA5577M233AC-DBB Notice File
Microchip
4 Pages / 0.04 MByte

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