TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 2 Pin |
Case/Package | SOD-523 |
Number of Positions | 2 Position |
Forward Voltage | 1.25V @150mA |
Thermal Resistance | 500℃/W (RθJA) |
Reverse recovery time | 4 ns |
Forward Current | 250 mA |
Max Forward Surge Current (Ifsm) | 4 A |
Maximum Forward Voltage (Max) | 1.25 V |
Forward Current (Max) | 250 mA |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -65 ℃ |
Junction Temperature | 150℃ (Max) |
Power Dissipation (Max) | 500 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 1.25 mm |
Size-Width | 0.85 mm |
Size-Height | 0.65 mm |
Operating Temperature | -65℃ ~ 150℃ |
The BAS516 from NXP is surface mounted low leakage diode in SOD-523 package. This is an Epitaxial, medium-speed switching diode with a low leakage current and encapsulated in a small SOD323 SMD plastic package.
● Automotive grade AEC-Q101 qualified
● Maximum repetitive reverse voltage of 100V
● Power dissipation is 500mW
● Operating ambient temperature range from -65°C to 150°C
● Non repetitive peak forward surge current is 4A
● Reverse recovery time of 4ns
● Forward voltage of 1.25V at IF 150mA
NXP
206 Pages / 0.21 MByte
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