| TYPE | DESCRIPTION |
|---|
| Case/Package | SOT-23 |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Unknown |
Driver Transistor
●NPN Silicon
●INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE
●MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
●Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
Motorola
3 Pages / 0.06 MByte
Motorola
4 Pages / 0.03 MByte
Fairchild
Trans GP BJT NPN 80V 0.2A 3Pin SOT-23 T/R
ON Semiconductor
NPN General Purpose Amplifier
NXP
Trans GP BJT NPN 80V 0.1A Automotive 3Pin TO-236AB
Infineon
High Voltage Transistors \\- SOT23 NPN AF Switching Transistor
KEC(Korea Electronics)
EPITAXIAL PLANAR NPN TRANSISTOR
Zetex
SOT23 NPN SILICON PLANAR HIGH VOLTAGE TRANSISTOR
Philips
Trans GP BJT NPN 80V 0.1A Automotive 3Pin TO-236AB
Diotec Semiconductor
Surface mount Si-Epitaxial PlanarTransistors
ROHM Semiconductor
Small Signal Bipolar Transistor,
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