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BYD37G,135
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BYD37G,135 Datasheet PDF - NXP

Manufacturer:NXP
Category:Power Diodes
Case Package:MELF
Description:Cavity free cylindrical glass package through Implotec technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
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BYD37G,135 Datasheet PDF (12 Pages)
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BYD37G,135 Specifications

TYPEDESCRIPTION
Number of Pins2 Pin
Case/PackageMELF
Operating Temperature (Max)175 ℃
Operating Temperature (Min)-65 ℃

BYD37G,135 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusObsolete
Size-Length3.7 mm
Size-Width2.1 mm
Size-Height2.1 mm

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