CC2564MODN Datasheet PDF - TI

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI"s seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

●Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

●The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI"s MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI"s third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

● Serial port profile (SPP)

● Advanced audio distribution profile (A2DP)

● Audio/video remote control profile (AVRCP)

● Hands-free profile (HFP)

● Human interface device (HID)

● Generic attribute profile (GATT)

● Several Bluetooth low energy profiles and services

●For more information, see TI Dual-Mode Bluetooth Stack.

●In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI"s wireless-connectivity/dual-mode-bluetooth page.

● Module Solution Based on TI"s CC2564B Dual-Mode Bluetooth®, Available in Two Variants:

● CC2564MODA With Integrated Antenna

● CC2564MODN With External Antenna

● Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1

● FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)

● CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)

● Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer

● Highly Optimized for Design Into Small Form Factor Systems and Flexibility:

● CC2564MODA

● Integrated Chip Antenna

● Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)

● CC2564MODN

● Single-Ended 50-Ω RF Interface

● Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)

● BR and EDR Features Include:

● Up to Seven Active Devices

● Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves

● Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet

● Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)

● Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power

● Support of Multiple Bluetooth Profiles With Enhanced QoS

● Low Energy Features Include:

● Support of up to 10 Simultaneous Connections

● Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption

● Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance

● Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy

● Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)

● Class 1.5 TX Power up to +10 dBm

● –93 dbm Typical RX Sensitivity

● Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required

● Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time

● Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions

● Advanced Power Management for Extended Battery Life and Ease of Design

● On-Chip Power Management, Including Direct Connection to Battery

● Low Power Consumption for Active, Standby, and Scan Bluetooth Modes

● Shutdown and Sleep Modes to Minimize Power Consumption

● Physical Interfaces:

● UART Interface With Support for Maximum Bluetooth Data Rates

● UART Transport Layer (H4) With Maximum Rate of 4 Mbps

● Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps

● Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface

● CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

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