| TYPE | DESCRIPTION |
|---|
| Number of Pins | 4 Pin |
| Case/Package | Picostar-4 |
| Power Dissipation | 800 mW |
| Rise Time | 14 ns |
| Input Capacitance (Ciss) | 1070pF @4V(Vds) |
| Fall Time | 32 ns |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 600 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET™ device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile. The Land Grid Array (LGA) package is a silicon chip scale package with metal pads instead of solder balls.
TI
Trans MOSFET P-CH 8V 7.4A 4Pin PICOSTAR T/R
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