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SMAJ30A
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© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: BA.10/21/20
Surface Mount – 400W > SMAJ series
TVS Diodes
Description
Agency Approvals
Agency Agency File Number
E230531
Features
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter Symbol Value Unit
Peak Pulse Power Dissipation at TA=25° by
10/1000us Waveform(Fig.2)(Note 1), (Note 2)
-Single Die Parts
P
PPM
400 W
Peak Pulse Power Dissipation at TA=25° by
10/1000us Waveform(Fig.2)(Note 1), (Note
2)-Stacked Die Parts(Note 5)
P
PPM
600 W
Power Dissipation on Infinite Heat Sink at
T
L
=50
O
C
P
D
3.3 W
Peak Forward Surge Current, 8.3ms Single Half
Sine Wave (Note 3)
I
FSM
60 A
Maximum Instantaneous Forward Voltage at
25A for Unidirectional Only (Note 4)
V
F
3.5/5.0 V
Operating Temperature Range T
J
-65 to 150 °C
Storage Temperature Range T
STG
-65 to 175 °C
Typical Thermal Resistance Junction to Lead R
θJL
30 °C/W
Typical Thermal Resistance Junction to Ambient R
θJA
120 °C/W
The SMAJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
400W Peak pulse power
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
Excellent clamping
capability
Typical I
R
less than 1μA
when V
BR
min>12V
For surface mounted
applications to optimize
board space
• Low profile package
Typical failure mode is
short from over-specified
voltage or current
Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
ESD protection of data
lines in accordance with
IEC 61000-4-2
EFT protection of data
lines in accordance with
IEC 61000-4-4
• Built-in strain relief
Fast response time:
typically less than 1.0ps
from 0 Volts to V
BR
min
• Glass passivated junction
• Low inductance
High temperature
to reflow soldering
guaranteed: 260°C/30sec
V
BR
@ T
J
= V
BR
@25°C
x (1+
αT x (T
J
- 25))
(
αT:Temperature
Coefficient, typical value
is 0.1%)
Plastic package is
flammability rated V-0 per
Underwriters Laboratories
Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°C
Matte tin lead–free Plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
SMAJ Series
Uni-directional
Bi-directional
Functional Diagram
Bi-directional
Uni-directional
Cathode
Anode
RoHS
Pb
e3
Datasheet
Additional Infomarion
Resources
Samples
Notes:
1. Non-repetitive current pulse, per Fig.4 and derated above T
J
(initial) =25ºC per Fig. 3.
2. Mounted on 5.0x5.0mm copper pad to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.
5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics.
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