Part Datasheet Search > Infineon > DF200R12W1H3FB11BOMA1 Datasheet PDF
DF200R12W1H3FB11BOMA1
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DF200R12W1H3FB11BOMA1 Datasheet PDF - Infineon

Manufacturer:Infineon
Case Package:AG-EASY1B-2
Description:Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Documentation:DF200R12W1H3FB11BOMA1 Datasheet (11 Pages)DF200R12W1H3FB11BOMA1 User Reference Manual Guide (36 Pages)DF200R12W1H3FB11BOMA1 Application Note (33 Pages)
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DF200R12W1H3FB11BOMA1 Specifications

TYPEDESCRIPTION
Case/PackageAG-EASY1B-2
Breakdown Voltage (Collector to Emitter)1200 V
Input Capacitance (Cies)6.15nF @25V
Input Power (Max)20 mW
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DF200R12W1H3FB11BOMA1 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusActive
PackagingTray
Operating Temperature-40℃ ~ 150℃
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DF200R12W1H3FB11BOMA1 Documents

DF200R12W1H3FB11BOMA1 Datasheet
Infineon
11 Pages / 0.83 MByte
DF200R12W1H3FB11BOMA1 User Reference Manual Guide
Infineon
36 Pages / 3.45 MByte
DF200R12W1H3FB11BOMA1 Other Datasheet PDF
Infineon
73 Pages / 2.93 MByte
DF200R12W1H3FB11BOMA1 Application Note
Infineon
33 Pages / 2.24 MByte

DF200R12W1H3FB11 Documents

DF200R12W1H3F_B11 Datasheet PDF
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
DF200R12W1H3FB11BOMA1 Datasheet PDF
Infineon
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
DF200R12W1H3FB11BPSA1 Datasheet PDF
Infineon
Mod Diode Bridge Easy1b-2-1
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