TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 6 Pin |
Voltage Rating (DC) | 20.0 V |
Current Rating | 6.20 A |
Case/Package | TSOT-23-6 |
Number of Positions | 6 Position |
Drain to Source Resistance (on) (Rds) | 0.024 Ω |
Polarity | N-Channel |
Power Dissipation | 1.6 W |
Threshold Voltage | 820 mV |
Input Capacitance | 1.12 nF |
Gate Charge | 10.5 nC |
Drain to Source Voltage (Vds) | 20 V |
Breakdown Voltage (Gate to Source) | ±8.00 V |
Continuous Drain Current (Ids) | 6.20 A |
Rise Time | 13 ns |
Input Capacitance (Ciss) | 1125pF @10V(Vds) |
Input Power (Max) | 800 mW |
Fall Time | 11 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 1.6W (Ta) |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 3 mm |
Size-Width | 1.7 mm |
Size-Height | 1 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
The FDC637AN is a 2.5V specified single N-channel MOSFET produced using Fairchild Semiconductor"s advanced PowerTrench® process. It has been especially tailored to minimize ON-state resistance and yet maintain low gate charge for superior switching performance. It is designed to offer exceptional power dissipation in a very small footprint compared with bigger SO-8 and TSSOP-8 packages. It is suitable for use in DC-to-DC converter, load switching and battery protection applications.
● Fast switching speed
● High performance Trench technology for extremely low RDS (ON)
● 10.5nC Typical low gate charge
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