| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | SOIC-8 |
| Number of Positions | 8 Position |
| Drain to Source Resistance (on) (Rds) | 0.021 Ω |
| Power Dissipation | 2 W |
| Threshold Voltage | 1.9 V |
| Drain to Source Voltage (Vds) | 40 V |
| Rise Time | 5 ns |
| Input Capacitance (Ciss) | 955pF @20V(Vds) |
| Input Power (Max) | 2 W |
| Fall Time | 3 ns |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 2000 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 5 mm |
| Size-Width | 4 mm |
| Size-Height | 1.5 mm |
| Operating Temperature | -55℃ ~ 150℃ (TJ) |
The FDS8949 is a dual N-channel logic level MOSFET produced using advanced PowerTrench® process. It has been especially tailored to minimize the ON-state resistance and yet maintain superior switching performance. It is well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.
ON Semiconductor
6 Pages / 0.33 MByte
ON Semiconductor
8 Pages / 0.38 MByte
ON Semiconductor
5 Pages / 0.58 MByte
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