TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Number of Pins | 4 Pin |
Case/Package | DIP-4 |
Rise/Fall Time | 100µs, 20µs |
Input Voltage (DC) | 1.20 V |
Output Voltage | ≤300 V |
Number of Circuits | 1 Circuit |
Number of Channels | 1 Channel |
Forward Voltage | 1.2 V |
Input Current | 50.0 mA |
Power Dissipation | 0.15 W |
Rise Time | 100 µs |
Isolation Voltage | 5000 Vrms |
Forward Current | 50 mA |
Output Voltage (Max) | 300 V |
Reverse Breakdown Voltage | 6 V |
Maximum Forward Voltage (Max) | 1.4 V |
Forward Current (Max) | 50 mA |
Fall Time | 20 µs |
Fall Time (Max) | 100 µs |
Fall Time (Max) | 300 µs |
Operating Temperature (Max) | 100 ℃ |
Operating Temperature (Min) | -30 ℃ |
Power Dissipation (Max) | 150 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tube |
Size-Height | 4 mm |
Operating Temperature | -30℃ ~ 100℃ |
Description
●The FOD852 consists of gallium arsenide infrared emitting diode driving a silicon photodarlington output (with integral base-emitter resistor) in a 4-pin dual in-line package.
●Features
●■Applicable to Pb-free IR Reflow Soldering
●■Compact 4-pin Package
●■High Current Transfer Ratio: 1000% Minimum
●■C-UL, UL, and VDE Approved
●■High Input-Output Isolation Voltage of 5000 VRMS
●■High Operating Temperature of 100°C
●Applications
●■Power Supply Regulators
●■Digital Logic Inputs
●■Microprocessor Inputs
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