| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 23 Pin |
| Case/Package | Module |
| Power Rating | 175 W |
| Polarity | N-Channel |
| Power Dissipation | 175 W |
| Breakdown Voltage (Collector to Emitter) | 600 V |
| Input Capacitance (Cies) | 3.1nF @25V |
| Input Power (Max) | 175 W |
| Operating Temperature (Max) | 150 ℃ |
| Operating Temperature (Min) | 40 ℃ |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tray |
| Operating Temperature | -40℃ ~ 150℃ |
Summary of Features:
● Low Switching Losses
● Trench IGBT 3
● V(CEsat) with positive Temperature Coefficient
● Low V(CEsat)
● Al(2)O(3) Substrate with Low Thermal Resistance
● Compact Design
● Solder Contact Technology
● Rugged mounting due to integrated mounting clamps
●Benefits:
● Compact module concept
● Optimized customer’s development cycle time and cost
● Configuration flexibility
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