| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | TDSON-8 |
| Number of Channels | 2 Channel |
| Number of Positions | 8 Position |
| Drain to Source Resistance (on) (Rds) | 0.028 Ω |
| Polarity | Dual N-Channel |
| Power Dissipation | 65 W |
| Threshold Voltage | 1.6 V |
| Drain to Source Voltage (Vds) | 55 V |
| Continuous Drain Current (Ids) | 20A |
| Rise Time | 5 ns |
| Input Capacitance (Ciss) | 610pF @25V(Vds) |
| Fall Time | 15 ns |
| Operating Temperature (Max) | 175 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 65 W |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 5.15 mm |
| Size-Width | 5.9 mm |
| Size-Height | 1 mm |
| Operating Temperature | -55℃ ~ 175℃ |
Summary of Features:
● Dual N-Channel
● Enhancement mode
● Logic Level
● 150 °C operating temperature
● Avalanche rated
● dv/dt rated
● Green Product(RoHS compliant)
● AEC Qualified.
●Benefits:
● Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction.
● Bond wire is 200um for up to 20A current
● Larger source lead frame connection for wire bonding
● Package: PG-TDSON-8-4
● Same thermal and electrical performance as a DPAK with the same die size.
● Exposed pad provides excellent thermal transfer (varies by die size)
● Two N-Channel MOSFETs in one package with 2 isolated leadframes
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