IRF6644TR1 Datasheet PDF - International Rectifier

Description

●The IRF6644 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

●• Lead and Bromide Free ①

●• Low Profile (<0.7 mm)

●• Dual Sided Cooling Compatible ①

●• Ultra Low Package Inductance

●• Optimized for High Frequency Switching ①

●• Ideal for High Performance Isolated Converter Primary Switch Socket

●• Optimized for Synchronous Rectification

●• Low Conduction Losses

●• Compatible with existing Surface Mount Techniques ①