TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 8 Pin |
Case/Package | SOIC-8 |
Power Rating | 2.5 W |
Number of Positions | 8 Position |
Drain to Source Resistance (on) (Rds) | 0.07 Ω |
Polarity | P-Channel |
Power Dissipation | 2.5 W |
Threshold Voltage | 3 V |
Drain to Source Voltage (Vds) | 30 V |
Continuous Drain Current (Ids) | 4.6A |
Rise Time | 21 ns |
Input Capacitance (Ciss) | 870pF @10V(Vds) |
Input Power (Max) | 2.5 W |
Fall Time | 71 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -55 ℃ |
Power Dissipation (Max) | 2500 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tube |
Material | Silicon |
Size-Length | 5 mm |
Size-Width | 4 mm |
Size-Height | 1.5 mm |
Operating Temperature | -55℃ ~ 150℃ (TJ) |
The IRF7205PBF is a HEXFET® fourth generation single P-channel Power MOSFET utilizes advanced processing techniques to achieve the lowest possible ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient device for use in a wide variety of applications. It has been modified through a customized lead-frame for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapour phase, infrared or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
● Advanced process technology
● Dynamic dV/dt rating
● Fast switching
● Low static drain-to-source ON-resistance
● Fully avalanche rating
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