DESCRIPTION
●Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
●The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU/SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications.
●FEATURES
●• Dynamic dV/dt Rating
●• Surface Mount (IRFR024/SiHFR024)
●• Straight Lead (IRFU024/SiHFU024)
●• Available in Tape and Reel
●• Fast Switching
●• Ease of Paralleling
●• Simple Drive Requirements
●• Lead (Pb)-free Available
Kersemi Electronic
7 Pages / 4.34 MByte
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