GENERAL DESCRIPTION
●The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi
●message voice record and playback device ideally suited to a variety of electronic systems. The
●message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
●specific device.
●FEATURES
●Integrated message management systems for single-chip, push-button applications
● o REC:level-trigger for recording
● o PLAY:edge-trigger for individual message or level-trigger for looping playback sequentially
● o ERASE:edge-triggered erase for first or last message or level-triggered erase for all messages
● o FWD:edge-trigger to advance to the next message or fast message scan during the playback
● o VOL: 8 levels output volume control
● o INT RDY : ready or busy status indication
● o RESET: return to the default state
● o Automatic power-down after each operation cycle
●Message and operation indicators
● o Four customizable Sound Effects (SEs) for audible indication
● o Optional vAlert (voiceAlert) to indicate the presence of new messages
● o LED: stay on during recording, blink during playback, forward and erase operations
●Dual operating modes
● o Standalone mode:
● Integrated message management techniques
● Automatic power-down after each operation cycle
● o SPI mode:
● Fully user selectable and controllable options via APC register and various SPI commands
●Two individual input channels
● o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)
● o AnaIn: single-ended auxiliary analog input for recording or feed-through
●Dual output channels
● o Differential PWM Class D speaker outputs directly drives an 8 Ωspeaker or a typical buzzer
● o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
●ChipCorder standard features
● o High-quality, natural voice and audio reproduction
● o 2.4V to 5.5V operating voltage
● o 100-year message retention (typical)
● o 100,000 record cycles (typical)
●Temperature options:
● o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
● o Industrial: -40°C to +85°C (packaged units)
●Packaging types: available in die, PDIP, SOIC and TSOP
●Package option: Lead-free packaged units
