| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 4 Pin |
| Case/Package | DIP-4 |
| Rise/Fall Time | 4µs, 3µs |
| Output Voltage | 35.0 V |
| Number of Channels | 1 Channel |
| Number of Positions | 4 Position |
| Forward Voltage | 1.2 V |
| Input Current | 20 mA |
| Power Dissipation | 200 mW |
| Rise Time | 4 µs |
| Isolation Voltage | 5.3 kV |
| Forward Current | 50 mA |
| Output Voltage (Max) | 80 V |
| Maximum Forward Voltage (Max) | 1.4 V |
| Forward Current (Max) | 50 mA |
| Fall Time | 3 µs |
| Fall Time (Max) | 18 µs |
| Fall Time (Max) | 18 µs |
| Operating Temperature (Max) | 100 ℃ |
| Operating Temperature (Min) | -30 ℃ |
| Power Dissipation (Max) | 200 mW |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Each |
| Operating Temperature | -30℃ ~ 100℃ |
The ISP817XSM is a 1-channel 4-pin high density mounting Optically Coupled Isolator consists of infrared light emitting diodes and NPN silicon phototransistors. It is suitable for industrial systems controllers, signal transmission between systems of different potentials and impedances.
● All electrical parameters 100% tested
● 80V Minimum high BVCEO
● 50mA Forward current
● 6V Reverse voltage
● 200mW Total power dissipation
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