LDC1101EVM Datasheet PDF - TI

The LDC1101EVM is an Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The board includes an example of a PCB sensor coil that connects to the LDC1101. An MSP430 MCU is used to interface the LDC to a host computer. This module is designed to provide the user with maximum flexibility for system prototyping. It is perforated at two locations, one, between the PCB sensor coil (LC tank) and the LDC1101 IC and another, between the LDC1101 IC and the MSP430 interface. The first perforation gives the user the option to snap off the PCB coil from the module and experiment with custom sensor coil. The second perforation allows the user to connect the LDC1101+sensor coil to a different MCU system or use multiple such sensors in one system. An accompanying GUI allows for maximum flexibility and quick system prototyping.

● Demonstrates LDC1101 operation with 1.8V

● Detachable example sensor coil included

● Easy system prototyping capability

● Up to 183ksps output data sampling rate from LDC

● Micro-USB connection to PC