TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Frequency | 52.0 kHz |
Number of Pins | 5 Pin |
Case/Package | TO-263-5 |
Number of Outputs | 1 Output |
Output Voltage | 12 V |
Output Current | 3 A |
Number of Channels | 1 Channel |
Number of Positions | 5 Position |
Quiescent Current | 5.00 mA |
Number of Regulated Outputs | 1 Output |
Switching Frequency | 52 kHz |
Topology | Buck |
Input Voltage (Max) | 40 V |
Input Voltage (Min) | 4 V |
Output Voltage (Min) | 12 V |
Output Current (Max) | 3 A |
Operating Temperature (Max) | 125 ℃ |
Operating Temperature (Min) | -40 ℃ |
Supply Voltage | 4 V |
Input Voltage | 40 V |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tube |
Size-Length | 10.16 mm |
Size-Width | 8.64 mm |
Size-Height | 4.57 mm |
Operating Temperature | -40℃ ~ 125℃ |
The LM2576S-12/NOPB is a 3A low component count Step-down Regulator offers a high-efficiency replacement for popular three-terminal linear regulators. It substantially reduces the size of the heat sink and in some cases no heat sink is required. A standard series of inductors optimized for use with the LM2576 are available from several different manufacturers. This feature greatly simplifies the design of switch-mode power supplies. Other features include a specified ±4% tolerance on output voltage within specified input voltages and output load conditions and ±10% on the oscillator frequency. External shutdown is included, featuring 50µA (typical) standby current. The output switch includes cycle-by-cycle current limiting, as well as thermal shutdown for full protection under fault conditions. This monolithic integrated circuit that provide all the active functions for a step-down (buck) switching regulator, capable of driving 3A load with excellent line and load regulation.
● TTL shutdown capability, low power standby
● High efficiency
● Uses readily available standard inductors
● Thermal shutdown and current limit protection
● P+ Product enhancement tested
●This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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