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LMC6001BIN
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LMC6001BIN Datasheet PDF - National Semiconductor

Manufacturer:National Semiconductor
Case Package:DIP
Description:IC, OP-AMP, 1.3MHz, 1.5V/µs, DIP-8
Documentation:LMC6001BIN Datasheet (14 Pages)Package Outline Dimension on12 Page
Part Numbering System on1 Page
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LMC6001BIN Datasheet PDF (14 Pages)
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LMC6001BIN Specifications

TYPEDESCRIPTION
Mounting StyleThrough Hole
Case/PackageDIP
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LMC6001BIN Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusUnknown
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LMC6001BIN Documents

LMC6001BIN Datasheet
National Semiconductor
14 Pages / 0.33 MByte

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