| TYPE | DESCRIPTION |
|---|
| Mounting Style | Solder, Horizontal |
| Case/Package | TO-218 |
| Thermal Resistance | 5.9 ℃/W |
| TYPE | DESCRIPTION |
|---|
| Size-Length | 25.4 mm |
| Size-Width | 35 mm |
| Size-Height | 50 mm |
The MC33275 is a 50 x 35 x 25.6mm compact high power dissipation vertical mounting extruded Heat Sink with solderable fixing pins. This heat sink can be mounted through mounting holes and is suitable for use with a single TO2-18 TO-220 and TO 247 devices with mounting hole.
Multicomp
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