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MPC860ENZQ66D4
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MPC860ENZQ66D4 Datasheet PDF - NXP

Manufacturer:NXP
Category:Microprocessors
Case Package:BGA-357
Description:MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
Documentation:MPC860ENZQ66D4 Datasheet (56 Pages)
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MPC860ENZQ66D4 Datasheet PDF (56 Pages)
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MPC860ENZQ66D4 Specifications

TYPEDESCRIPTION
Mounting StyleSurface Mount
Frequency66 MHz
Number of Pins357 Pin
Case/PackageBGA-357
Halogen Free StatusHalogen Free
Number of Bits32 Bit
Power Dissipation762 mW
Operating Temperature (Max)95 ℃
Operating Temperature (Min)0 ℃
Power Dissipation (Max)762 mW
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MPC860ENZQ66D4 Size & Package

TYPEDESCRIPTION
Product Lifecycle StatusActive
PackagingTray
Operating Temperature0℃ ~ 95℃ (TA)
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MPC860ENZQ66D4 Documents

MPC860ENZQ66D4 Datasheet
NXP
56 Pages / 0.8 MByte
MPC860ENZQ66D4 Other Datasheet PDF
NXP
68 Pages / 1.07 MByte
MPC860ENZQ66D4 Features Description Parametrics
NXP
80 Pages / 0.99 MByte

MPC860ENZQ66 Documents

MPC860ENZQ66D4 Datasheet PDF
Freescale
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
MPC860ENZQ66D4 Datasheet PDF
NXP
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
MPC860ENZQ66D4557 Datasheet PDF
Freescale
POWERQUICC 32 BIT POWER ARCHITEC
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