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MPC860ENZQ66D4

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MPC860ENZQ66D4 Datasheet PDF - Freescale

Manufacturer:	Freescale
Category:	Microprocessors
Case Package:	PBGA-357
Description:	MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray
Documentation:	MPC860ENZQ66D4 Datasheet (80 Pages)Pinout Diagram on73 PageHot Package Outline Dimension on74 Page 75 Page Part Numbering System on70 Page 71 Page 72 Page 73 Page 74 Page
Pictures:	3D Model Symbol Footprint Pinout Product Pictures

MPC860ENZQ66D4 Datasheet PDF (80 Pages)

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MPC860ENZQ66D4 Specifications

TYPE	DESCRIPTION
Mounting Style	Surface Mount
Number of Pins	357 Pin
Case/Package	PBGA-357
Halogen Free Status	Halogen Free
Number of Bits	32 Bit
Operating Temperature (Max)	95 ℃
Operating Temperature (Min)	0 ℃

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MPC860ENZQ66D4 Size & Package

TYPE	DESCRIPTION
Product Lifecycle Status	Not Recommended for New Designs
Packaging	Tray
Operating Temperature	0℃ ~ 95℃ (TA)

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MPC860ENZQ66D4 Environmental

MPC860ENZQ66D4 Function Overview

MPC860ENZQ66D4 Documents

MPC860ENZQ66D4 Datasheet

Freescale

80 Pages / 1.07 MByte

MPC860ENZQ66D4 Features Description Parametrics

Freescale

77 Pages / 0.74 MByte

MPC860ENZQ66 Documents

MPC860ENZQ66D4 Datasheet PDF

Freescale

MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray

MPC860ENZQ66D4 Datasheet PDF

NXP

MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 66MHz 357Pin BGA Tray

MPC860ENZQ66D4557 Datasheet PDF

Freescale

POWERQUICC 32 BIT POWER ARCHITEC

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