TYPE | DESCRIPTION |
---|
Number of Pins | 87 Pin |
Case/Package | NFBGA-87 |
RAM Memory Size | 8K x 8 |
Number of ADCs | 1 ADC |
Operating Temperature (Max) | 85 ℃ |
Operating Temperature (Min) | -40 ℃ |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Operating Temperature | -40℃ ~ 85℃ (TA) |
The MSP430FR599x microcontrollers (MCUs) take low power and performance to the next level with the unique Low-Energy Accelerator (LEA) for digital signal processing. This accelerator delivers 40x the performance of ARM® Cortex®-M0+ MCUs to help developers efficiently process data using complex functions such as FFT, FIR, and matrix multiplication. Implementation requires no DSP expertise with a free optimized DSP Library available. Additionally, with up to 256KB of unified memory with FRAM, these devices offer more space for advanced applications and flexibility for effortless implementation of over-the-air firmware updates.
●The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of Flash.
●MSP430FR599x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits for the MSP430FR599x include the MSP-EXP430FR5994 LaunchPad™ development kit and the MSP-TS430PN80B 80-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer.
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