● For surface mounted application
● Low profile package
● Built-in strain relief,
● Ideal for automated placement
● Easy pick and place
● Superfast recovery time for high efficiency
● Glass passivated chip junction
● High temperature soldering: 250 ℃/10 seconds at terminals
● Plastic material used carries Underwriters Laboratory Classification 94V-O
● Cases: JEDEC DO-214AA(SMB) molded plastic body
● Terminals: Solder plated,solderable per MIL--STD-750,Method 2026
● Polarity: Colour band denotes cathode end
● Weight: 0.003 ounce, 0.093 gram
