TYPE | DESCRIPTION |
---|
Mounting Style | Surface Mount |
Number of Pins | 4 Pin |
Case/Package | TO-261-4 |
Number of Positions | 4 Position |
Drain to Source Resistance (on) (Rds) | 0.07 Ω |
Power Dissipation | 3 W |
Threshold Voltage | 1.6 V |
Drain to Source Voltage (Vds) | 60 V |
Rise Time | 7.5 ns |
Input Capacitance (Ciss) | 345pF @25V(Vds) |
Input Power (Max) | 1.1 W |
Fall Time | 7 ns |
Operating Temperature (Max) | 150 ℃ |
Operating Temperature (Min) | -65 ℃ |
Power Dissipation (Max) | 3000 mW |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tape & Reel (TR) |
Size-Length | 6.5 mm |
Size-Width | 3.56 mm |
Size-Height | 1.6 mm |
Operating Temperature | -65℃ ~ 150℃ |
The NDT3055L is a N-channel logic level enhancement mould MOSFET using high cell density, DMOS technology. This very high density process has been especially tailored to minimize on-state resistance, provide superior switching performance and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as DC/DC converters, PWM motor controls and other battery powered circuits where fast switching, low in-line power loss and resistance to transients are needed.
● High density cell design for extremely low RDS (ON)
● High power and current handling capability
● Low drive requirements allowing operation directly from logic drivers
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