DESCRIPTION
●The NTE series of miniature surface mounted DC/DC Converters employ leadframe technology and transfer moulding techniques to bring all of the benefits of IC style packaging to hybrid circuitry. The devices are fully compatible with CECC00802 to 280°C which allows them to be placed and reflowed with IC’s, thus reducing time and cost in production. The co-planarity of the pin positions is based upon IEC 191-6:1990. The devices are suitable for all applications where high volume production is envisaged.
●FEATURES
●■ Wide Temperature Performance at Full 1 Watt Load, –40°C to 85°C
●■ Lead Frame Technology
●■ Maximum Reflow Temperature 280°C
●■ Single Isolated Output
●■ 1kVDC Isolation
●■ Efficiency to 78%
●■ Power Density 1.8W/cm3
●■ 3.3V, 5V & 12V Input
●■ 3.3V, 5V, 9V, 12V and 15V Output
●■ Footprint Over Pins 1.64cm2
●■ UL 94V-0 Package Material
●■ No Heatsink Required
●■ Internal SMD Construction
●■ Toroidal Magnetics
●■ Plastic Encapsulated
●■ MTTF up to 2.9 Million Hours
●■ Custom Solutions Available
●■ Multi Layer Ceramic Capacitors
●■ Lead Free Compatible
