TYPE | DESCRIPTION |
---|
Case/Package | LFQFP |
RAM Memory Size | 3K x 8 |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Not Recommended |
Packaging | Tray |
Operating Temperature | -40℃ ~ 125℃ (TA) |
Overview
●This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions athigh speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking.
●Furthermore, the data flash (1 KB x2 blocks) is embedded in the R8C/23 Group.
●The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same.
●Applications
●Automotive, etc.
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