| TYPE | DESCRIPTION |
|---|
| Case/Package | - |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
FEATURES
●◇ For surface mounted applications in order to optimize board space.
●◇ Low profile package.
●◇ Built-in strain relief.
●◇ Glass passivated junction.
●◇ Low inductance.
●◇ Excellent clamping capability.
●◇ Repetition Rate (duty cycle): 0.01%.
●◇ Fast response time: typically less than 1.0ps from 0 volt to VBR for 8nidirectional types.
●◇ Typical IR less than 1μA above 10V.
●◇ High Temperature soldering: 260°C/10 seconds at terminals.
●◇ Plastic package has Underwriters Laboratory Flammability 94V-O.
Meritek
4 Pages / 0.06 MByte
Meritek
5 Pages / 0.13 MByte
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