| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 6 Pin |
| Case/Package | XFDFN-6 |
| Number of Outputs | 1 Output |
| Output Current | 32.0 mA |
| Number of Circuits | 1 Circuit |
| Number of Channels | 1 Channel |
| Number of Bits | 1 Bit |
| Propagation Delay Max (tpd) | 3.00 ns |
| Number of Gates | 1 Gate |
| Number of Inputs | 1 Input |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 1.65V ~ 5.5V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Operating Temperature | -40℃ ~ 125℃ |
This single inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
●NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
●The output of the SN74LVC1G06 device is open-drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
●This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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