| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 6 Pin |
| Supply Voltage (DC) | 1.65V ~ 5.50V |
| Case/Package | DSBGA-6 |
| Number of Outputs | 1 Output |
| Number of Circuits | 1 Circuit |
| Number of Bits | 1 Bit |
| Propagation Delay Max (tpd) | 3.40 ns |
| Voltage Nodes | 5.00 V, 3.30 V, 2.50 V, 1.80 V |
| Number of Gates | 1 Gate |
| Number of Inputs | 3 Input |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 1.65V ~ 5.5V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Operating Temperature | -40℃ ~ 85℃ |
This device is designed for 1.65-V to 5.5-V VCC operation.
●The SN74LVC1G0832 device is a single 3-input positive AND-OR gate. It performs the Boolean function Y = (A • B ) + C in positive logic.
●By tying one input to GND or VCC, the SN74LVC1G0832 device offers two more functions. When C is tied to GND, this device performs as a 2−input AND gate (Y = A • B). When A is tied to VCC, the device works as a 2−input OR gate (Y = B + C). This device also works as a 2−input OR gate when B is tied to VCC (Y = A + C).
●NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
●This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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