| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 6 Pin |
| Supply Voltage (DC) | 1.65V ~ 5.50V |
| Case/Package | DSBGA-6 |
| Number of Outputs | 1 Output |
| Number of Circuits | 1 Circuit |
| Number of Bits | 1 Bit |
| Propagation Delay Max (tpd) | 3.60 ns |
| Voltage Nodes | 5.00 V, 3.30 V, 2.50 V, 1.80 V |
| Number of Gates | 1 Gate |
| Output Current Drive | -1.00 mA |
| Number of Inputs | 3 Input |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Supply Voltage | 1.65V ~ 5.5V |
| Supply Voltage (Max) | 5.5 V |
| Supply Voltage (Min) | 1.65 V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 1.4 mm |
| Size-Width | 0.9 mm |
| Size-Height | 0.3 mm |
| Operating Temperature | -40℃ ~ 85℃ |
The SN74LVC1G27 device performs the Boolean function Y = A + B + C or Y = A • B • C in positive logic.
●NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
●This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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