STW33N20 Datasheet PDF - ST Microelectronics

DESCRIPTION

●The Max220TM package is a new high volume power package exibiting the same footprint as the industry standard TO-220, but designed to accomodate much larger silicon chips, normally supplied in bigger packages. The increased die capacity makes the device ideal to reduce component count in multiple paralleled TO-220 designs and save board space with respect to larger packages.

●■ TYPICAL RDS(on) = 0.85 Ω

●■ EFFICIENT AND RELAIBLE MOUNTING THROUGH CLIP

●■ ± 30V GATE TO SOURCE VOLTAGE RATING

●■ 100% AVALANCHE TESTED

●■ GATE CHARGE MINIMIZED

●■ REDUCED THRESHOLD VOLTAGE SPREAD.

●APPLICATIONS

●■ HIGH CURRENT, HIGH SPEED SWITCHING

●■ SWITCH MODE POWER SUPPLIES (SMPS)

●■ DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)