| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 20 Pin |
| Supply Voltage (DC) | 4.50 V |
| Case/Package | QFN-20 |
| Supply Current | 10 mA |
| Number of Channels | 2 Channel |
| Power Dissipation | 5.2 W |
| Quiescent Current | 8.00 mA |
| Output Power | 80 mW |
| Gain | 63.52 dB |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Power Dissipation (Max) | 5200 mW |
| Supply Voltage | 1.8V ~ 4.5V |
| Supply Voltage (Max) | 4.5 V |
| Supply Voltage (Min) | 1.8 V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Size-Length | 4 mm |
| Size-Width | 4 mm |
| Size-Height | 0.73 mm |
| Operating Temperature | -40℃ ~ 85℃ (TA) |
The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.
●The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.
●The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
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