TYPE | DESCRIPTION |
---|
Mounting Style | Through Hole |
Number of Pins | 8 Pin |
Supply Voltage (DC) | 15.0V (max) |
Case/Package | PDIP-8 |
Rise/Fall Time | 20ns, 15ns |
Number of Outputs | 2 Output |
Output Current | 4 A |
Power Dissipation | 350 mW |
Rise Time | 20 ns |
Fall Time | 15 ns |
Fall Time (Max) | 40 ns |
Fall Time (Max) | 40 ns |
Operating Temperature (Max) | 105 ℃ |
Operating Temperature (Min) | -40 ℃ |
Power Dissipation (Max) | 350 mW |
Supply Voltage | 4V ~ 15V |
Supply Voltage (Max) | 15 V |
Supply Voltage (Min) | 4 V |
TYPE | DESCRIPTION |
---|
Product Lifecycle Status | Active |
Packaging | Tube |
Size-Length | 9.81 mm |
Size-Width | 6.35 mm |
Size-Height | 4.57 mm |
Operating Temperature | -40℃ ~ 105℃ |
The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.
●Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
●The UCC2742x provides enable (ENB) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to VDD for active high logic and can be left open for standard operation.
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