| TYPE | DESCRIPTION |
|---|
| Mounting Style | Surface Mount |
| Number of Pins | 8 Pin |
| Case/Package | SOIC-8 |
| Rise/Fall Time | 20ns, 15ns |
| Number of Outputs | 2 Output |
| Output Current | 4 A |
| Power Dissipation | 650 mW |
| Rise Time | 20 ns |
| Fall Time | 15 ns |
| Fall Time (Max) | 40 ns |
| Fall Time (Max) | 40 ns |
| Operating Temperature (Max) | 125 ℃ |
| Operating Temperature (Min) | -40 ℃ |
| Power Dissipation (Max) | 650 mW |
| Supply Voltage | 4V ~ 15V |
| Supply Voltage (Max) | 15 V |
| Supply Voltage (Min) | 4 V |
| TYPE | DESCRIPTION |
|---|
| Product Lifecycle Status | Active |
| Packaging | Tape & Reel (TR) |
| Operating Temperature | -40℃ ~ 125℃ |
The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.
●Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
●The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to VDD for active-high logic and can be left open for standard operation.
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