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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic copy
08 Jun 2009
SUBJECT: ON Semiconductor Final Product/Process Change Notification #16266
TITLE: Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and
SC88/SC88A Packages.
PROPOSED FIRST SHIP DATE: 08 Sep 2009
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Assembly Areas – Wire Bond
AFFECTED PRODUCT DIVISION(S): Rectifier Business unit, Small Signal Transistor Business
Unit, and ESD and Protection Business Unit
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Eben Lim < eben.lim@onsemi.com
>
SAMPLES: Contact your local ON Semiconductor Sales Office or Eben Lim <eben.lim@onsemi.com
>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Laura Rivers <laura.rivers@onsemi.com
>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of
the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for
their SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A packages. Discrete
products built with bipolar transistor, rectifier, zener diode, schottky diode, and switching diode
platforms are represented by this Process Change Notice.
Reliability Qualification and full electrical characterization over temperature has been performed.
Issue Date: 08 Jun 2009 Rev.14 Jun 2007 Page 1 of 36
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