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MLZ2012A1R0P Other Datasheet PDF - TDK
| Manufacturer: | TDK |
| Category: | Inductor Surface Mount |
| Case Package: | 0805 |
| Description: | 0805 1uH ±25% 220mA |
| Pictures: |
MLZ2012A1R0PDatasheet PDF
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005-02 / 20090921 / e533_mlz2012.fm
• All specifications are subject to change without notice.
SMD Inductors(Coils)
For Power Line(Multilayer, Magnetic Shielded)
MLZ Series MLZ2012
The MLZ Series is a new line of laminated choke coils for decou-
pling with the industry’s best DC superimposition characteristics
and lowest DC resistance
∗
. TDK has developed this coil using its
proprietary ferrite material technique and dense electrodes.
The MLZ Series exerts an excellent effect mainly on the decou-
pling of power circuits. It also exerts an effect on audio lines
because of its low DC resistance.
The DC superimposition characteristics of the MLZ2012-W Series
(IDC UP type) have been improved by up to 250% in comparison
with those of other existing products. New addition of 22 and 47μH
products has satisfied more needs: low through to high frequency
ranges are supported.
∗
The MLZ Series was regarded as having the industry’ s best DC
superimposition characteristics and lowest DC resistance according to
research conducted in September 2009.
FEATURES
• The IDC UP type is a line of products with the industry’s best DC
superimposition characteristics.
• High-inductance(22 and 47μH products have been introduced).
• Thanks to a broad inductance range (0.1 to 47μH), wide-ranging
needs (from low through to high frequency ranges) can be
satisfied.
APPLICATIONS
Modules such as digital cellular phone and camera module, Net-
books, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Inductance value
(5) Management symbol
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range –55 to +125°C
Storage temperature range –55 to +125°C
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLZ 2012 A 1R0 M T
(1) (2) (3) (4) (5) (6)
2012 2.0× 1.25mm
R10 0.1μH
1R0 1.0 μH
100 10.0 μH
MSTD
W IDC-UP
T Taping [reel]
Packaging style Thickness T(mm) Quantity
Taping 0.85 4000 pieces/reel
1.25 2000 pieces/reel
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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